Welcome To EECT 2023
Sanya, China ┃ March 24-26, 2023

Topics

Electronic Materials Components; Circuits and Systems; Computer Networks; Computer Architecture

Submission Instructions

Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference.

Publication and Indexing

After a rigorous reviewing process, accepted papers after proper registration and presentation will be included in Conference Proceedings, and submitted to Ei Compendex and Scopus for indexing.

Important Dates

Submission Deadline : Jan. 30, 2023
Paper Status Notification : Feb. 20, 2023
Registration Deadline: March 10, 2023


Submission and Review Process

Submitted Papers to the conference will be subjected to the rigorous peer-review process and are expected to meet standards of academic excellence. EECT 2023 will follow a double-blind reviewing process to make the review process as fair as possible, both reviewers' and authors' identities remain anonymous.

All papers that conform to the submission guidelines will be peer-reviewed by at least 2-3 members of the Program Committee, which will take 15-20 working days before the result comes out. Authors will receive review comments via email and be required to do necessary revisions if the paper is accepted.

An Initial Plagiarism Check is carried out for every manuscript submitted to EECT 2023, the "Similarity Index" should be below 30%.

All registered and presented papers will be published in the volume of EECT 2023 conference proceedings, published in IOP Journal of Physics: Conference Series (JPCS), indexed by Ei Compendex, SCOPUS, CPCI and other important database, etc.

* Update News:

EECT 2022 conference proceeding published in Journal of Physics: Conference Series, Volume 2253, 2022 and indexed by EI and Scopus within 2 month. (More Details)

EECT 2021 conference proceeding published in Journal of Physics: Conference Series, Volume 1914, 2021 and indexed by EI and Scopus within 3 month.
(More Details)